Reno Sub-Systems’ gas flow and RF power products address critical customer needs of technology enablement, precision and unmatched repeatability. To equipment OEMs, Reno’s RF and flow sub-systems products provide systematic and differentiating performance enhancements to standard deposition and etch tools without the need for costly tool redesign.
For device manufacturers, Reno’s products promise an order-of-magnitude improvement in process control to enable manufacturing of leading-edge devices.
Reno’s two enabling patented technologies open the plasma processing door to deep submicron feature sizes and the very short process times necessary for both planar and 3D device architectures. In addition to new process regimes, Reno’s process control technologies facilitate “always on” plasma management, reducing on-wafer particles, improving film properties and reducing cost per transistor, thereby enabling Moore’s law.
Reno’s RF and Flow technologies are backed by a strong patent portfolio, with multiple patents issued and pending.
Instantaneous Match™ and power RF technologies enable ≤14nm semiconductor manufacturing
FlowNode™ and FastGas™ technologies remove the barriers to next-generation high volume production