During SEMICON West 2017, Reno executives met with Françoise von Trapp, editor in chief at 3D InCites. In her recent article “3D InCites: Heterogeneous Integration Versus Dimensional Scaling; One Year In, Part 2” she quotes Reno along with a number of executives from industry-leading companies.
Entegris, traditionally a front-end company focused on developing products that purify, protect, and transport critical materials used in semiconductor manufacturing, has extended efforts in the past 12-18 months beyond front-end applications to include heterogeneous integration technologies. memsstar, a company that specializes in refurbished tools for the semiconductor market as well as new tools designed for MEMS processing, reports that it won’t be greatly impacted, as the transition will take time, and the company serves both markets. Manufacturers of electronic performance materials, like Brewer Science and Merck, are now emphasizing development in advanced packaging materials while still maintaining their lithography materials for front-end technologies. Then there’s Reno Sub-Systems, a two-year old start up whose plasma ignition subsystem for plasma deposition tools are targeted towards enabling future nodes, and sees ample opportunity from the four companies who will continue scaling efforts. Lastly, there are companies like Invensas, a subsidiary of Xperi; EV Group, UnItySC, and Ultratech, a division of Veeco, who saw the writing on the wall 10 years ago and have been focused on advanced wafer level packaging and 3D Integration ever since. They are particularly excited about what this means for them.