Author: Reno

Reno Sub-Systems is excited to welcome two industry leaders to our board of directors- Jeff Andreson and Jorge Titinger.   Andreson brings an extensive industry background and solid financial credentials to his...

Reno Sub-Systems is excited to announce the receipt of a repeat order for our matched sets of dual-frequency Velocity™ EVC™ Matching Networks and Precis™ Solid State RF Power Generators! This...

Invented in 2017, with the first filings for patents on July 10, 2017, our Level-to-Level (L2L™) pre-pulse switching technology truly sets us apart. With this approach, the EVC switches shortly...

The move into our expanded New Jersey facility is officially complete, doubling our space and providing the needed room for our growing engineering efforts. We have installed multiple, fully facilitized...

As semiconductor wafer processing equipment becomes more and more complex, equipment OEMs are highly focused on the process, or “on-wafer results,” rather than the actual hardware itself. This has created...

As semiconductor manufacturing moves to 10nm and below, advancements in more than just processes and materials come into play. Current equipment subsystem technologies simply do not offer the speed or...

Reno Sub-Systems recently received an order for a Velocity™ EVC™ matching network to go on another new tool design. This is a first-time order with this top equipment supplier and...