Author: admin_renosub

Here at Reno, leveraging our patented technologies is at the core of what we do. Our team strives to create the leading technologies our customers need to solve the challenges...

In some ways, little changed in the industry focus in 2017, nor will it in 2018. We continue to seek higher performance from smaller devices that consume less power and...

Technical Editor Mark Andrews recently spoke with Reno’s top executives, following their announcements of Series C funding from Samsung Venture Investment Corp. and many other leading IDMs and OEMs, as...

Reno Sub-Systems develops semiconductor manufacturing systems for nanoscale IC processes. These include RF matching networks, RF power generators and gas delivery systems.   The company has closed its Series C funding which...

This article was originally published at EE Times. By Dylan McGrath   A group of chip companies led by Samsung and Intel have invested $11.2 million in a supplier of semiconductor manufacturing process...

Series C investments from Samsung Venture Investment Corp. and leading IDMs and OEMs reflect commitment to Reno's radically better subsystem technologies   Reno Sub-Systems (Reno), a developer of high-performance radio frequency (RF)...

During SEMICON West 2017, Reno executives met with Françoise von Trapp, editor in chief at 3D InCites. In her recent article "3D InCites: Heterogeneous Integration Versus Dimensional Scaling; One Year...

Reno's new Precis™ Generator platform was announced in the run up to the leading US SEMI tradeshow, SEMICON West. The news was covered in the SEMICON West Show Daily, follow the...

Precis™ Solid-State Microwave Generators deliver the precise power control required for advanced semiconductor manufacturing below 10nm   SPARKS, Nevada – July 10, 2017 – Reno Sub-Systems, the industry-leading producer of high-performance radio frequency (RF)...

Two of Asia’s top technical publications recently interviewed Reno’s Bill Suber on the latest trends in gas flow control technologies for semiconductor fabrication. He explained why the current thermal-based and...