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Technology

Plasma processing is a critical technology in the fabrication of advanced microelectronic circuits. In order to create advanced devices (sub-14nm), highly repeatable, precisely controlled, short cycle-time plasma etching and deposition are essential. Variation on these leading-edge processes are measured on the atomic scale. Plasma processing environments require single-atom-layer removal and deposition. While vacuum control and measurement have kept pace with industry needs, gas flow control and RF matching network technologies have not.

Reno Sub-Systems’ gas flow and RF power products address critical customer needs of technology enablement, precision and unmatched repeatability. To equipment OEMs, Reno’s RF and flow sub-systems products provide systematic and differentiating performance enhancements to standard deposition and etch tools without the need for costly tool redesign.

 

For device manufacturers, Reno’s products promise an order-of-magnitude improvement in process control to enable manufacturing of leading-edge devices.

Reno’s two enabling patented technologies open the plasma processing door to deep submicron feature sizes and the very short process times necessary for both planar and 3D device architectures. In addition to new process regimes, Reno’s process control technologies facilitate “always on” plasma management, reducing on-wafer particles, improving film properties and reducing cost per transistor, thereby enabling Moore’s law.

 

Reno’s RF and Flow technologies are backed by a strong patent portfolio, with multiple patents issued and pending.

Reno_Power

Instantaneous MatchTM and power RF technologies enable ≤14nm semiconductor manufacturing

Flow Products

FlowNodeTM and FastGasTM technologies remove key barriers to next-generation high volume production